Part Name:Power Module Material:High TG Thick copper Material and Thickness:FR-4,2.0mm Layer Coverage:10 Layer Surface Technique: Immersion gold Specialty: Copper Weight 4oz,Blind and Buried vias, output large electricity For more information about our products. Please feel free to contact u

Part Name: PCB with gold fingers Material:FR-4 Thickness: 1.6mm Layer Coverage: 4 layer Surface Technique: Gold plated Specialty: double side gold fingers For more information about our products. Please feel free to contact us.