Power Module

Part Name:Power Module Material:High TG Thick copper Material and Thickness:FR-4,2.0mm Layer Coverage:10 Layer Surface Technique: Immersion gold Specialty: Copper Weight 4oz,Blind and Buried vias

Posted Date: 19 Dec 2008

From : Hong Kong Credit PCB Technology Co., Ltd [ Hong Kong ]

Related Categories

Electronic Components & Spares

Related Keywords

Power Module - High TG Thick copper - Telecommunication - PCB - Immersion Gold - Double Side Board - Memory Bank

PCB withGold Fingers

Part Name: PCB with gold fingers Material:FR-4 Thickness: 1.6mm Layer Coverage: 4 layer Surface Technique: Gold plated Specialty: double side gold fingers For more information about our produ

Posted Date: 19 Dec 2008

From : Hong Kong Credit PCB Technology Co., Ltd [ Hong Kong ]

Related Categories

Electronic Components & Spares

Related Keywords

PCB with Gold Fingers - Gold Plated - PCB - Memory Bank - Telecommunication - Double Side Board - Power Module