Power Module

Part Name:Power Module Material:High TG Thick copper Material and Thickness:FR-4,2.0mm Layer Coverage:10 Layer Surface Technique: Immersion gold Specialty: Copper Weight 4oz,Blind and Buried vias

Posted Date: 19 Dec 2008

From : Hong Kong Credit PCB Technology Co., Ltd [ Hong Kong ]

Related Categories

Electronic Components & Spares

Related Keywords

Power Module - High TG Thick copper - Telecommunication - PCB - Immersion Gold - Double Side Board - Memory Bank