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Part Name:Power Module Material:High TG Thick copper Material and Thickness:FR-4,2.0mm Layer Coverage:10 Layer Surface Technique: Immersion gold Specialty: Copper Weight 4oz,Blind and Buried vias
Posted Date: 19 Dec 2008
Electronic Components & Spares
Power Module - High TG Thick copper - Telecommunication - PCB - Immersion Gold - Double Side Board - Memory Bank